Syracuse University

JW Surety Bonds Scholarship

SCHOLARSHIP ANNOUNCEMENT

  • TITLE: JW Surety Bonds Scholarship


  • SPONSOR: JW Surety Bonds


  • ELIGIBILITY: Full-time undergraduate students may apply.


  • AMOUNT: $1000


  • DEADLINE: September 30


  • WEBSITE: http://www.jwsuretybonds.com/scholarship/


  • ADDITIONAL INFO: The JW Surety Bonds Scholarship was created to give students a chance to win up to $1000 toward college tuition, while providing an opportunity to showcase skills in their respective fields of study and obtain professional experience for their resumes. Students will submit original content in the form of their choosing: an article, video, infographic, etc., which is focused on a specific business category we provide. You can read more about the scholarship program here: http://www.jwsuretybonds.com/scholarship/.